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| PL IA Features Lead free device (RoHS compliant*) Glass passivated chip Low reverse leakage current Low forward voltage drop High current capability *R oH S CO M NT CD214C-F350~F3600 Fast Response Rectifiers General Information The markets of portable communications, computing and video equipment are challenging the semiconductor industry to develop increasingly smaller electronic components. Bourns offers Glass Passivated Rectifiers for rectification applications, in compact chip DO-214AB (SMC) size format, which offers PCB real estate savings and are considerably smaller than competitive parts. The Glass Passivated Rectifier Diodes offer a forward current of 3.0 A with a choice of repetitive peak reverse voltage of 50 V up to 600 V. Bourns Chip Diodes(R) conform to JEDEC standards, are easy to handle on standard pick and place equipment and their flat configuration minimizes roll away. Electrical Characteristics (@ TA = 25 C Unless Otherwise Noted) Parameter Symbol CD214CF350 F3100 F3200 F3400 F3600 Unit Maximum Repetitive Peak Reverse Voltage Maximum RMS Voltage Maximum DC Blocking Voltage Maximum Average Forward Rectified Current (@ TL = 100 C)1 DC Reverse Current @ Rated DC Blocking Voltage (@TJ = 25 C) DC Reverse Current @ Rated DC Blocking Voltage (@TJ = 125 C) Typical Junction Capacitance2 Maximum Instantaneous Forward Voltage @ 3 A Typical Thermal Resistance3 Peak forward surge current 8.3 ms single half sine-wave superimposed on rated load (JEDEC Method) Maximum Reverse Recovery Time VRRM VRMS VDC I(AV) IR IR CJ VF RJA IFSM Trr 50 35 50 100 70 100 200 140 200 3.0 10.0 500.0 45 400 280 400 600 420 600 V V V A A A pF 0.92 15 100 25 1.25 1.30 V C/W A ns Notes: 1 See Forward Derating Curve. 2 Measured at 1 MHz and an applied reverse voltage of 4.0 V. 3 Thermal resistance from junction to lead. Thermal Characteristics (@ TA = 25 C Unless Otherwise Noted) Parameter Operating Temperature Range Storage Temperature Range Symbol TJ TSTG CD214C-F350~F3600 -55 to +150 -55 to +150 Unit C C *RoHS Directive 2002/95/EC Jan 27 2003 including Annex. Specifications are subject to change without notice. Customers should verify actual device performance in their specific applications. CD214C-F350~F3600 Fast Response Rectifiers Product Dimensions This is a lead free product using 100 % Sn termination. It is a molded plastic package. A cathode band indicates the polarity. The package weighs approximately 0.21 g. The package and dimensions are shown below. 6.60 - 7.11 (0.260 - 0.280) Recommended Pad Layout 2.69 MAX. (0.106) 2.10 MIN. (0.083) 5.59 - 6.22 (0.220 - 0.240) 2.92 - 3.18 (0.115 - 0.125) 1.27 MIN. (0.050) DIMENSIONS: MM (INCHES) How To Order CD 214C - F 3 50 2.01 - 2.62 (0.080 - 0.103) 0.76 - 1.52 (0.03 - 0.06) 7.75 - 8.13 (0.305 - 0.320) 0.05 - 0.20 (0.002 - 0.008) 0.15 - 0.31 (0.006 - 0.012) Common Code CD = Chip Diode Package 214C = SMC/DO-214AB Model Series F = Fast Rectifier Forward Current I(AV) 3=3A Reverse Voltage 50 = 50 V 100 = 100 V 200 = 200 V 400 = 400 V 600 = 600 V DIMENSIONS: MM (INCHES) Typical Part Marking CD214C-F350 ............................................................................ CD214C-F3100 .......................................................................... CD214C-F3200 .......................................................................... CD214C-F3400 .......................................................................... CD214C-F3600 .......................................................................... F3A F3B F3D F3G F3J Specifications are subject to change without notice. Customers should verify actual device performance in their specific applications. CD214C-F350~F3600 Fast Response Rectifiers Packaging Information The product will be dispensed in Tape and Reel format (see diagram below). P 0 P 1 E Index Hole 120 F W B D2 D1 D T d P Trailer A Device C Leader End ....... ....... 10 pitches (min.) ....... ....... ....... ....... ....... ....... 10 pitches (min.) W1 Start DIMENSIONS: MM (INCHES) Direction of Feed Devices are packed in accordance with EIA standard RS-481-A and specifications shown here. Item Carrier Width Carrier Length Carrier Depth Sprocket Hole Reel Outside Diameter Reel Inner Diameter Feed Hole Diameter Sprocket Hole Position Punch Hole Position Punch Hole Pitch Sprocket Hole Pitch Embossment Center Overall Tape Thickness Tape Width Reel Width Quantity per Reel Symbol A B C d D D1 D2 E F P P0 P1 T W W1 -- SMC (DO-214AB) 7.22 0.10 (0.284 0.004) 8.11 0.10 (0.319 0.004) 2.36 0.10 (0.093 0.004) 1.55 0.05 (0.061 0.002) 330 (12.992) 50.0 Min. (1.969) 13.0 0.20 (0.512 0.008) 1.75 0.10 (0.069 0.004) 7.50 0.10 (0.295 0.004) 4.00 0.10 (0.157 0.004) 4.00 0.10 (0.157 0.004) 2.00 0.10 (0.079 0.004) 0.30 0.10 (0.012 0.004) 16.00 0.20 (0.630 0.008) 22.4 Max. (0.882) 3,000 Specifications are subject to change without notice. Customers should verify actual device performance in their specific applications. CD214C-F350~F3600 Fast Response Rectifiers Performance Graphs Forward Current Derating Curve 3.0 2.5 2.0 1.5 1.0 0.5 0 25 50 75 100 125 150 175 Lead Temperature (C) Single Phase Half Wave 60 Hz Resistive or Inductive Load Peak Forward Surge Current (Amps) Average Forward Current (Amps) Maximum Non-Repetitive Surge Current 100 80 60 40 20 0 1 2 5 10 20 50 100 Number of Cycles at 60 Hz Pulse Width 8.3 ms Single Half Sine-Wave (JEDEC Method) Typical Forward Characteristics 10.0 F350-F3200 F3600 Typical Reverse Characteristics 1000 Instantaneous Reverse Leakage Current (mA) Instantaneous Forward Current (Amps) F3400 100 TJ = 125 C 1.0 10 TJ = 25 C 0.1 1.0 Pulsewidth: 300 s TJ = 25 C 0.01 0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 Instantaneous Forward Voltage (Volts) 0.1 0 20 40 60 80 100 120 140 Percent of Rated Peak Reverse Voltage (%) Reliable Electronic Solutions Asia-Pacific: Tel: +886-2 2562-4117 * Fax: +886-2 2562-4116 Europe: Tel: +41-41 768 5555 * Fax: +41-41 768 5510 The Americas: Tel: +1-951 781-5500 * Fax: +1-951 781-5700 www.bourns.com COPYRIGHT(c) 2005, BOURNS, INC. LITHO IN U.S.A., IPA0508 10/05 Specifications are subject to change without notice. Customers should verify actual device performance in their specific applications. |
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